SemiAI Presents AI for Semiconductor Manufacturing Processes at AI UNBOUND NYC in New York

Taekwon Jee, CEO of semiconductor manufacturing AI company SemiAI, took part in the pitching session at PEN-CTA (AI UNBOUND NYC), held at Sixth Floor Loft in New York on October 15, 2026. He introduced agentic AI for semiconductor manufacturing processes designed to improve yield.

The presentation was part of the 2026 TIPS Global Delegation to the United States. SemiAI participated as one of 10 TIPS startups. The New York program runs from October 14 to 16 and includes investor pitches, business meetups, and local networking opportunities.

AI UNBOUND NYC brings selected Korean AI companies together with local investors and representatives from businesses and economic development agencies. The event’s program includes startup pitches, reverse pitches by economic development agencies, a workshop on raising investment in the United States, and networking sessions.

Jee’s presentation identified connecting data as a central challenge in analytics. With the message “The bottleneck is not data — it is connection,” he highlighted the importance of connecting data from semiconductor manufacturing operations to support analysis and decision-making.

SemiAI is developing SMILE, an agentic AI platform for semiconductor manufacturing processes. The platform focuses on connecting process data analysis and reporting into a single workflow and supporting engineers’ decisions through prediction and anomaly detection. The presentation introduced this approach to AI for semiconductor manufacturing to local investors and industry professionals in New York.