APR 07, 2026
EPE Budget Component Analysis
10-2026-00630542 · KP26017
Inventors
Taekwon Jee, Jihoon Jung
Applicant
SemiAI, Co.,Ltd.
Official Title
METHOD OF DETERMINING A BUDGET COMPONENT FOR ANALYSIS OF EDGE PLACEMENT ERROR IN SEMICONDUCTOR MANUFACTURING PROCESS AND MANUFACTURING PROCESS ANALYZING DEVICE USING THE SAME
Summary
The present invention relates to determining a budget component effective for improving yield in a semiconductor manufacturing process, and more specifically, to a method for determining a budget component for analyzing an edge placement error corresponding to the difference between edge information on a design pattern in a semiconductor manufacturing process and edge information on a measurement pattern obtained by measuring the result of the semiconductor manufacturing process, and to a manufacturing process analysis device using the same.